AMD AGESA 1.0.0.6: Memoria RAM hasta 4000 MHz en AMD Ryzen y dividir la GPU
AMD sigue lanzando nuevos firmware para añadir nuevas actualizaciones del micro-código a las BIOS que dan vida a las placas base AMD Ryzen, esta vez llegando la versión AGESA 1.0.0.6 que da un paso más en la maduración de la plataforma permitiendo a los profesionales, gamers y overclockers tener una ganancia de rendimiento adiciona, ya que ahora la compañía promete que, con la adición de 26 nuevos parámetros en la configuración de la memoria RAM, se ha mejorado tanto la compatibilidad como la fiabilidad con los módulos DRAM DDR4, especialmente aquellos que no cumple con los estándares JEDEC, como aquellos que superen los 2667 MHz, permitan un OC manual o incluyan perfiles Intel XMP2.
Esta nueva actualización de AGESA también aporta la compatibilidad con los servicios de control de acceso (ACS) de PCI Express. Esta capacidad es especialmente útil para los usuarios que deseen emplear sus tarjetas gráficas para la aceleración en 3D dentro de una máquina virtual. Con el apoyo de ACS, es posible dividir una GPU en dos, por ejemplo pudiendo usar un sistema operativo Linux y una máquina virtual de Windows mediante una única tarjeta dedicada. La máquina virtual puede acceder a todas las capacidades de la GPU dedicada y ejecutar juegos dentro de la máquina virtual con un rendimiento casi nativo.
Parámetro | Función | Valor |
---|---|---|
Memory clocks | Added dividers for memory clocks up to DDR4-4000 without refclk adjustment. Please note that values greater than DDR4-2667 is overclocking. Your mileage may vary (as noted by our big overclocking wartning at the end of this blog). | 133.33MT/s intervals (2667, 2933, 3067, 3200, 3333, 3466, 3600, 3733, 3866, 4000) |
Command rate (CR) | The amount of time, in cycles, between when a DRAM chip is selected and a command is executed. 2T CR can be very beneficial for stability with high memory clocks, or for 4-DIMM configurations. | 2T, 1T |
ProcODT (CPU on-die termination) | A resistance value, in ohms, that determines how a completed memory signal is terminated. Higher values can help stabilize higher data rates. Values in the range of 60-96 can prove helpful. | Integer values (ohms) |
tWCL/tWL/tCWL | CAS Write Latency, or the amount of time it takes to write to the open memory bank. WCL is generally configured equal to CAS or CAS-1. This can be a significant timing for stability, and lower values often prove better. | Integer values (cycles) |
tRC | Row cycle time, or the number of clock cycles required for a memory row to complete a full operational cycle. Lower values can notably improve performance, but should not be set lower than tRP+tRAS for stability reasons. | Integer values (cycles) |
tFAW | Four activation window, or the time that must elapse before new memory banks can be activated after four ACTIVATE commands have been issued. Configured to a minumum 4x tRRD_S, but values >8x tRRD_S are often used for stability. | Integer values (ns) |
tWR | Write recovery time, or the time that must elapse between a valid write operation and the precharging of another bank. Higher values are often beneficial for stability, and values < 8 can quickly corrupt data stored in RAM. | Integer values (ns) |
CLDO_VDDP | Voltage for the DDR4 PHY on the SoC. Somewhat
counterintuitively, lowering VDDP can often be more beneficial for
stability than raising CLDO_VDDP. Advanced overclockers should also
know that altering CLDO_VDDP can move or resolve memory holes.
Small changes to VDDP can have a big effect, and VDDP should not be
set to a value greater than VDIMM-0.1V. A cold reboot is required
if you alter this voltage.
Sidenote: pre-1.0.0.6 BIOSes may also have an entry labeled “VDDP” that alters the external voltage level sent to the CPU VDDP pins. This is not the same parameter as CLDO_VDDP in AGESA 1.0.0.6. |
Integer values (V) |
tRDWR / tWRRD | Read-to-write and write-to-read latency, or the time that must elapse between issuing sequential read/write or write/read commands. | Integer values (cycles) |
tRDRD / tWRWR | Read-to-read and write-to-write latency, or the time between sequential read or write requests (e.g. DIMM-to-DIMM, or across ranks). Lower values can significantly improve DRAM throughput, but high memory clocks often demand relaxed timings. | Integer values (cycles) |
Geardown Mode | Allows the DRAM device to run off its internally-generated ½ rate clock for latching on the command or address buses. ON is the default for speeds greater than DDR4-2667, however the benefit of ON vs. OFF will vary from memory kit to memory kit. Enabling Geardown Mode will override your current command rate. | On/Off |
Rtt | Controls the performance of DRAM internal termination resistors during nominal, write, and park states. | Nom(inal), WR(ite), and Park integers (ohms) |
tMAW | Maximum activation window, or the maximum number of times a DRAM row can be activated before adjacent memory rows must be refreshed to preserve data. | Integer values (cycles) |
tMAC | Maximum activate count, or the number of times a row is activated by the system before adjacent row refresh. Must be equal to or less than tMAW. | Integer values (cycles) |
tRFC | Refresh cycle time, or the time it takes for the memory to read and re-write information to the same DRAM cell for the purposes of preserving information. This is typically a timing automatically derived from other values. | Integer values (cycles) |
tRFC2 | Refresh cycle time for double frequency (2x) mode. This is typically a timing automatically derived from other values. | Integer values (cycles) |
tRFC4 | Refresh cycle time for quad frequency (4x) mode. This is typically a timing automatically derived from other values. | Integer values (cycles) |
tRRD_S | Activate to activate delay (short), or the number of clock cycles between activate commands in a different bank group. | Integer values (cycles) |
tRRD_L | Activate to activate delay (long), or the number of clock cycles between activate commands in the same bank group. | Integer values (cycles) |
tWR | Write recovery time, or the time that must elapse between a valid write operation and the precharging of another bank. Higher values are often better for stability. | Integer values (ns) |
tWTR_S | Write to read delay (short), or the time between a write transaction and read command on a different bank group. | Integer values (cycles) |
tWTR_L | Write to read delay (long), or the time between a write transaction and read command on the same bank group. | Integer values (cycles) |
tRTP | Read to precharge time, or the number of clock cycles between a READ command to a row and a precharge command to the same rank. | Integer values (cycles) |
DRAM Power Down | Can modestly save system power, at the expense of higher DRAM latency, by putting DRAM into a quiescent state after a period of inactivity. | On/Off |